Cougar EVO
● Reliable, fast, and repeatable inspections - manually and automatically
● Automatic void calculation with VoidInspect
● Easy to use, dynamic enhancing filters, e.g., eHDR
● Best available laminography with micro3Dslice and FF CT software
● Dose reduction kit and low dose detector mode for sensitive components
● Smallest footprint available on the market
Inspection capabilities: outstanding. Footprint: only one sqm.
With its compact dimensions, the Cougar EVO is the perfect choice for X-ray inspection in SMT, the semiconductor industry, and laboratories. Designed as a solution for facilities with space limitations, it combines minimum size and maximum performance. The weight of the Cougar EVO makes it suitable for many standard building floors. In addition, its size and weight make bringing the system into the location quick and hassle-free. In many cases, the existing elevators can be used for transport.
Optimized automated X-ray and CT quality inspections
Cougar EVO responds to the need for improved, automated operation with integrated workflows in the FGUI operating software. The Comet Yxlon FF CT software is designed to start automatically for faster reconstruction and visualization. Due to its unique ability to render 3D cinematic images with a preset selection of transfer functions (TF), the software produces the most realistic, vivid visualization available today.
SMT inspections: grand performance for small devices
Due to the continuous miniaturization of products, more and more components must fit in an ever-smaller area. For the most accurate and repeatable quality inspection results, a test system must not only provide high performance and resolution but also needs to be equipped with dynamic image enhancement filters. The Comet Yxlon Cougar EVO features:
Large flat-panel detectorswith up to 50% larger field of view for a better overview and faster working processes due to reduced steps in automated processes
Best laminography with micro3Dslice, optimally suited for large PCBs, with detailed 3D visualization for quick and easy failure analysis - substantially cost-saving compared to micro sectioning
Automatic void calculation with VoidInspect, the laminography workflow enabling the rapid non-destructive analysis of voids inside the solder joints of board components
Integration in the production line: ProLoop (Link auf Video weiter unten) allows direct communication with inline AOI / AXI inspection
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Analysis of voids in LEDs with VoidInspect CL |
Cougar EVO SMT applications
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Semicon inspections: maximum resolution at minimum voltage
Electronic components and semiconductor devices are the key elements of most electronic systems. Due to their compactness and density, testing requires maximal image resolution at low power and low voltage. Void compilations, including multi-area voiding, need accurate, repeatable inspection routines. The Comet Yxlon Cougar EVO offers:
- ● Highly sensitive detector with optional dose reduction
- ● High detail recognition through an integrated image chain
- ● Integrated, automatic error detection in FGUI (Bumps, voids)
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Laminography scan of PCB wire bonds |
Cougar EVO semiconductor applications
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Laboratory inspections: leading technology for precise analysis
The inspection of electronic components during research and development is highly complex and requires a broad range of features. Computed tomography with the Comet Yxlon Cougar EVO is the technology of choice for detailed analyses of micro components such as those used in batteries, connectors, and medical devices.
Exceptional CT qualitydue to a range of highly sensitive detectors with an excellent contrast-to-noise ratio
Realistic, vivid visualization by Comet Yxlon FF CT software, the integrated workflow in the FGUI user interface with individual 3D cinematic renderers, artifact reduction, and a preset selection of transfer functions (TF)
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Laminography scan of micro bumps |
Cougar EVO lab applications
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Production line integration with ProLoop
ProLoop is Comet Yxlon's smart factory solution for the optimization of production processes. It enables direct communication with the inline AOI / AXI inspection systems and thus helps achieve maximum yield performance.
